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Except as expressly permitted in this Agreement, Licensee shall not use, modify, copy or distribute the Content or Modifications.
ON Semiconductor shall own any Modifications to the Software. The parties hereto are for all purposes of this Agreement independent contractors, and neither shall hold itself out as having any authority to act as an agent or partner of the other party, or in any way bind or commit the other party to any obligations.
FDMS7660 FDMS 7660
Upon reasonable advance written notice, ON Semiconductor shall have the right no more frequently than once in any 12 month period during the term of the Agreement, through an independent third party approved by Licensee in writing such approval not to be unreasonably withheldto examine and audit such records and Licensee’s compliance with the terms of Section 2.
Subject to the foregoing, this Agreement shall be binding upon and inure to the benefit of the parties, their successors and assigns.
Next generation enhanced body diode technology, engineered for soft recovery. Such license agreement may be a “break-the-seal” or “click-to-accept” license agreement.
This Agreement, including the Exhibits attached hereto, constitutes the entire agreement and understanding between the parties hereto regarding the subject matter hereof and supersedes all other agreements, understandings, promises, representations or discussions, written or oral, between the parties regarding the subject matter hereof.
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Previously Viewed Products Select Product BOM, Gerber, user manual, schematic, test procedures, etc.
FDMS7660 MOSFET. Datasheet pdf. Equivalent
Licensee agrees that it shall comply fully with all relevant and applicable export laws and regulations of the United States or foreign governments “Export Laws” to ensure that neither the Content, nor any direct product thereof is: ON Semiconductor shall have the right to terminate this Agreement upon written notice to Licensee if: It has been optimized for low gate charge, low r DS onfast switching speed and body diode reverse recovery performance.
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The following Sections of this Agreement shall survive the termination or expiration of 7606 Agreement for any reason: Advanced Package and Silicon combination for low r DS on and high efficiency. MSL1 robust package design. This product is general usage fms suitable for many different applications.
In that event, “Licensee” herein refers to such company.