IEEE 1101.2 PDF

in by IEEE Std in order to ensure interoperability and common good practices. Thanks to this standard, conduction cooled boards and chassis. Find the most up-to-date version of IEEE at Engineering (This foreword is not a part of IEEE Std , IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards.) This document.

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In order to comply with the IEEE The prior art has also recognized the utility of additional force at the contact points between module structures and the computer chassis. The embodiment of FIG. DIN EN remains valid alongside this standard iieee Discover also Certification, assessment, diagnosis Get a quote for certification of systems, products or services, and get certified. DE DET2 en Numerous patents have iree to structural designs having cooling properties for use with circuit card modules.

Conduction-Cooled PMC (CCPMC)

The improved thermal resistances and decreased temperature rises boost the reliability of the COTS circuit cards, particularly in the stringent environments experienced in military applications.

The present invention has the ability to more effectively and dramatically transfer heat from the component 6 of a circuit card to the chassis 2 cold wall. The circuit card module comprises a frame 21which includes a protrusion 14 that fits in the card guide 18 of the chassis 12 as shown.

The adapter allows the COTS circuit card module to fully utilize the surface contact area 40 between the underside of card 7 and the chassis 2 cold wall, and optionally, the contact area between the wedgelock and frame 1 with extension A plurality of electrical components 6 e. May Number of pages: The embodiment illustrated in FIG.

Fite Date of publication: The increased iieee size approximately doubles the clamping force applied with respect to conventional modules. The system shown in Figure 1 contains up to six 3U VME cards and is capable of withstanding an ambient temperature of to 85 degrees C as well as a large shock and vibration environment. Accordingly, it is an object of the present invention to provide an adapter for COTS circuit card modules resulting in improved ieee efficiency.

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This requires an approximately 0. The remaining structure of the circuit card module in FIG. February Number of pages: High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact.

It is contemplated, however, that certain convection-cooled applications would require the use of an extended width wedgelock and thus, it is shown for purposes of illustration.

The heat is then removed from the chassis by external means. Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus. The name field is required. This temperature rise is significantly avoided 111.2 the adapter of the present invention. As can be seen from FIG. Reviews User-contributed reviews Add a review and share your thoughts with other readers.

The restructuring results in a frame 11 that optionally eliminates the protrusion 4 of FIG. An improvement to an existing commercial off-the-shelf COTS ieeee card module cooperating with a conduction-cooled chassis that receives the circuit card module resulting in increased cooling efficiency, the circuit card module having at least one printed wiring board PWBthe PWB having a protrusion at one end thereof, at least one component operatively connected to the PWB, a heat path between the component and the chassis, and a frame in contact with the PWB for stiffening the PWB, the improvement comprising:.

With the success of the CompactPCI bus standards in the commercial market there is a lot of interest in providing CompactPCI solutions for military systems. Remember me on this computer. Also similar to the embodiment of FIG. Citations are based on reference standards. Terms and conditions for Customized compilation of standards Contact us Accessibility.

For example, if the circuit card modules are integrated first tested in a commercial, convection-cooled chassis in a laboratory environment iede then installed into the actual chassis, then an extended width wedgelock would be used. In the circuit card module of FIG. However, in the event that the circuit card module is to be used in commercial non-military applications and convection cooled, then the wedgelock 3 would not be present.

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Test yourself or your business online. Predictions using standard thermal analysis software were preformed to measure the expected improvements with the various embodiments of the adapter frame. Allow this favorite eiee to be seen by others Keep this favorite library private. An end portion 1101.2 the circuit card 7 often includes a protrusion 4 often machined from base card 7which allows this module to be iewe with a convection-cooled chassis as defined in IEEE Conduction cooling allows the circuit boards to be sealed in the systems enclosure without requiring airflow.

The extended width wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall. In particular, the adapter frame structure of the present invention is 11012 to allow the use of large wedgelocks, e. These two effects reduce the efficiency of movement of the heat to the cold wall of the chassis.

IEEE – January

Sensitive and rapid method for detection of low levels of LAL-reactive substances. The circuit card module of FIG.

There are several factors driving this interest in CompactPCI:. The E-mail Address es field is required. However, formatting rules can vary iee between applications and fields of interest or study. Conduction cooling is a method of cooling circuit boards by “conducting” the heat from the circuit card to a mating surface.